product details dimension a dimension b dimension c dimension d interface material finish notes: dimensions are measure d in millimeters dimensions a & b refer to component size dimension c = the height of the heat sink shown ab ove and d oes not includ e the height of the attachment method ats reserves the right to up d ate or change it prod ucts without notice c ontact ats to learn a b out custom options available 1) 2) 3) 4) 5) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-53290P-C1-R0 features & benefts high performance bga cooling solutions with maxigrip? attachment rev1_0908 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 5.0 3.9 3.4 3.1 2.8 2.6 2.5 3.2 29 mm 29 mm 17.5 mm 29 mm blue anodized chomerics t766 high aspect ratio, straight fin heat sinks that are ideal for compact pcb environments maxigrip ? attachment applies steady, even pressure to the component and does not require holes in the pcb designed specifically for bgas and other surface mount packages meets t elcordia gr-63-core o ffice v ibration, etsi 300 019 t ransportation v ibration, and mil-std-810 shock testing and unpackaged drop t esting standards comes preassembled with high performance, phase change, thermal interface material keep-out requirements: an un-populated boarder zone of 5 mm around the component is necessary to facilitate the installation/ removal of the maxigrip?. please refer to the maxigrip? keep- out guidelines and maxigrip? installation/removal instructions for further details ? ? ? ? ? ? *image above is for illustration purposes only.
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